To efficiently remove the tin layer from a printed circuit board (PCB), PCB dismantling machines use methods like heated, tumbling drums or rotating brushes, which apply heat (around 250-400°C) to smelt the tin and mechanical action to detach the electronic components and tin. Some systems use ultrasonic or chemical baths, like solutions of sodium hydroxide or fluoroboric acid, to dissolve the solder. The choice of machine depends on whether the goal is component recovery, board preprocessing, or material recycling.